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NEO Semiconductor’s revolutionary 3D X-DRAM for AI processors has passed proof-of-concept validation — company secures funding to develop next-gen memory HBM alternative

By kirklandc008@gmail.comApril 25, 20260

NEO Semiconductor announced on April 23rd that its 3D X-DRAM technology has successfully passed proof-of-concept (POC) validation, demonstrating that a…

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